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PSB 21382 H V1.3

PSB21382 Telecom device1 Circuits


  • Manufacturer: Infineon Technologies
  • Nocochips NO: 376-PSB 21382 H V1.3
  • Package: 64-QFP
  • Datasheet: -
  • Stock: 836
  • Description: PSB21382 Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 64-QFP
Packaging Tray
Series INCA™
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V 5V
Base Part Number PSB21382
Function CODEC
Interface IOM-2, Parallel, SCI
Number of Circuits 1
Current - Supply 27mA

PSB 21382 H V1.3 Overview


Board space can be saved by using the 64-QFP package.To pack telecommunications equipment, the way of Tray is used.A Surface Mount-mount is used for mounting the telecom circuit.1 circuits are used in this telecom IC .3.3V 5V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.By using the PSB21382 part number, more related parts can be found.27mA is the supply current.A number of similar functions of the telecommunication product can be provided by it as with those of electronic parts under the INCA? series.

PSB 21382 H V1.3 Features


Available in the 64-QFP package

PSB 21382 H V1.3 Applications


There are a lot of Infineon Technologies PSB 21382 H V1.3 Telecom applications.

  • Channel Service Units (CSUs): T1/E1/J1
  • Residential Gateways
  • Hybrid fiber coax (HFC)
  • Channel Banks
  • PBX interfaces
  • Digital Cross Connect Systems
  • E3/DS3 Access Equipment
  • PDH Multiplexers
  • Switches
  • Cable Modem

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