PSF 21150 H V1.4
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 64-QFP |
| Supplier Device Package | P-MQFP-64-1 |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Series | IPAC-X |
| Part Status | Discontinued |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.3V |
| Base Part Number | PSF21150 |
| Function | PC Adapter Circuit |
| Interface | ISDN |
| Number of Circuits | 1 |
| Current - Supply | 30mA |
| RoHS Status | Non-RoHS Compliant |
PSF 21150 H V1.4 Overview
Space is saved on the board by using the 64-QFP package.In order to pack telecommunications equipment, Tray is used.Surface Mount is used as telecommunications equipment mounting type.There are 1 circuits in this telecom IC .The voltage supplied to 3.3V can improve efficiency.Telecom switching is possible to achieve reliable performance when the operating temperature is set at -40°C~85°C.Using telecom switching's base part number of PSF21150, you can find more related parts.The current supply is 30mA.There are many similar functions of the telecommunication product that it can provide with the electronic components under the IPAC-X series.
PSF 21150 H V1.4 Features
Available in the 64-QFP package
PSF 21150 H V1.4 Applications
There are a lot of Infineon Technologies PSF 21150 H V1.4 Telecom applications.
- Central office
- Interfaces to DS3
- ATM equipment with integrated DS1 interfaces
- Multichannel DS1 Test Equipment
- Switching Systems
- Public switching systems
- Cable Telephony
- Intelligent PBX
- PBX (Private Branch Exchange)
- Fiber Optic Terminals
