Parameters | |
---|---|
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 4 |
Resistance | 3.15MOhm |
Terminal Finish | Tin (Sn) |
Additional Feature | HIGH RELIABILITY |
Technology | MOSFET (Metal Oxide) |
Terminal Position | SINGLE |
Terminal Form | GULL WING |
Pin Count | 4 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 106W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 106W |
Case Connection | DRAIN |
Turn On Delay Time | 24 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 2.4m Ω @ 25A, 10V |
Vgs(th) (Max) @ Id | 1.95V @ 1mA |
Input Capacitance (Ciss) (Max) @ Vds | 2542pF @ 12V |
Current - Continuous Drain (Id) @ 25°C | 100A Tc |
Gate Charge (Qg) (Max) @ Vgs | 39nC @ 10V |
Rise Time | 34ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 16 ns |
Turn-Off Delay Time | 36 ns |
Continuous Drain Current (ID) | 100A |
JEDEC-95 Code | MO-235 |
Gate to Source Voltage (Vgs) | 20V |
Max Dual Supply Voltage | 25V |
Drain to Source Breakdown Voltage | 25V |
Pulsed Drain Current-Max (IDM) | 636A |
Avalanche Energy Rating (Eas) | 60 mJ |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |
Package / Case | SC-100, SOT-669 |
Surface Mount | YES |
Number of Pins | 4 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2011 |
JESD-609 Code | e3 |
Part Status | Active |