Parameters | |
---|---|
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Terminal Finish | Tin (Sn) |
Technology | MOSFET (Metal Oxide) |
Terminal Form | GULL WING |
Pin Count | 3 |
JESD-30 Code | R-PSSO-G2 |
Number of Elements | 1 |
Power Dissipation-Max | 306W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 306W |
Case Connection | DRAIN |
Turn On Delay Time | 31 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 5.6m Ω @ 25A, 10V |
Vgs(th) (Max) @ Id | 4V @ 1mA |
Input Capacitance (Ciss) (Max) @ Vds | 8061pF @ 50V |
Current - Continuous Drain (Id) @ 25°C | 100A Tc |
Gate Charge (Qg) (Max) @ Vgs | 141nC @ 10V |
Rise Time | 46ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Factory Lead Time | 1 Week |
Vgs (Max) | ±20V |
Mounting Type | Surface Mount |
Fall Time (Typ) | 34 ns |
Turn-Off Delay Time | 83 ns |
Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Continuous Drain Current (ID) | 100A |
Surface Mount | YES |
Gate to Source Voltage (Vgs) | 20V |
Max Dual Supply Voltage | 100V |
Number of Pins | 3 |
Drain-source On Resistance-Max | 0.0056Ohm |
Transistor Element Material | SILICON |
Drain to Source Breakdown Voltage | 100V |
Operating Temperature | -55°C~175°C TJ |
Avalanche Energy Rating (Eas) | 468 mJ |
Packaging | Tape & Reel (TR) |
Radiation Hardening | No |
Published | 2012 |
JESD-609 Code | e3 |
RoHS Status | ROHS3 Compliant |
Part Status | Active |