Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 6-XFDFN Exposed Pad |
Number of Pins | 6 |
Diode Element Material | SILICON |
Operating Temperature | -30°C~85°C TA |
Packaging | Tape & Reel (TR) |
Published | 2012 |
JESD-609 Code | e4 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
Termination | SMD/SMT |
Type | Steering (Rail to Rail) |
Terminal Finish | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
Applications | USB OTG |
Additional Feature | ULTRA LOW CAPACITANCE |
Capacitance | 220pF |
Technology | AVALANCHE |
Terminal Position | DUAL |
Depth | 1.6mm |
Base Part Number | PUSBM |
Pin Count | 6 |
Operating Supply Voltage | 5.5V |
Number of Elements | 2 |
Working Voltage | 5.5V |
Configuration | COMPLEX |
Number of Channels | 4 |
Leakage Current | 500nA |
Power Line Protection | Yes |
Voltage - Breakdown (Min) | 6.4V |
Current - Peak Pulse (10/1000μs) | 3A 8/20μs |
Clamping Voltage | 12V |
Voltage - Reverse Standoff (Typ) | 5.5V Max |
Peak Pulse Current | 3A |
Reverse Standoff Voltage | 5.5V |
Max Surge Current | 12A |
Peak Pulse Power | 35W |
Direction | Unidirectional |
Unidirectional Channels | 3 |
Breakdown Voltage | 6.8V |
Non-rep Peak Rev Power Dis-Max | 100W |
Length | 1.6mm |
Radiation Hardening | No |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |