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QS7201-15Q

28 TerminationsFIFO memory IC4.5K 512 x 915ns


  • Manufacturer: Rochester Electronics, LLC
  • Nocochips NO: 699-QS7201-15Q
  • Package: -
  • Datasheet: -
  • Stock: 342
  • Description: 28 TerminationsFIFO memory IC4.5K 512 x 915ns (Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Bulk
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Number of Terminations 28
ECCN Code EAR99
Terminal Finish TIN LEAD
Additional Feature RETRANSMIT
HTS Code 8542.32.00.71
Technology CMOS
Voltage - Supply 4.5V~5.5V
Terminal Position DUAL
Terminal Form GULL WING
Supply Voltage 5V
JESD-30 Code R-PDSO-G28
Function Asynchronous
Current - Supply (Max) 60mA
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 4.5V
Memory Size 4.5K 512 x 9
Access Time 15ns
Data Rate 40MHz
Organization 512X9
Memory Width 9
Memory Density 4608 bit
Parallel/Serial PARALLEL
Retransmit Capability Yes
Programmable Flags Support No
Output Enable NO
Expansion Type Depth, Width
Cycle Time 25 ns
RoHS Status ROHS3 Compliant

QS7201-15Q Overview


It's packaged in the shape of a Bulk .It is possible to store data and applications on the FIFO chips as they have 4.5K 512 x 9 in their memory.The temperature should be kept at 0°C~70°C to ensure reliable operation.Surface Mount is the mounting type of the FIFO memory.Operation is based on a supply voltage of 4.5V~5.5V .60mA is memory IC's maximum operating supply current.It is possible to achieve high efficiency with a supply voltage of 5V .A total of 28 terminations are contained within FIFO means.This gadget can also generate RETRANSMIT .FIFO memory IC's maximum supply voltage is set to 5.5V .As a general rule, keep the supply voltage (Vsup) above 4.5V in order to ensure normal operation.

QS7201-15Q Features


4.5K 512 x 9 memory size

QS7201-15Q Applications


There are a lot of Rochester Electronics, LLC QS7201-15Q FIFOs Memory applications.

  • Communications
  • Video time base correction
  • Rate buffers
  • Cardiac Monitoring Device
  • Network bridges
  • Controlled baseline
  • Switches
  • IP Camera Buffer
  • Seismic Data Collection at Extreme Temperatures
  • Temporary storage elements

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