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QS7201-20P

28 TerminationsFIFO memory IC4.5K 512 x 920ns


  • Manufacturer: Rochester Electronics, LLC
  • Nocochips NO: 699-QS7201-20P
  • Package: -
  • Datasheet: -
  • Stock: 240
  • Description: 28 TerminationsFIFO memory IC4.5K 512 x 920ns (Kg)

Details

Tags

Parameters
Mounting Type Through Hole
Surface Mount NO
Operating Temperature 0°C~70°C
Packaging Bulk
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Number of Terminations 28
ECCN Code EAR99
Terminal Finish TIN LEAD
Additional Feature RETRANSMIT
HTS Code 8542.32.00.71
Technology CMOS
Voltage - Supply 4.5V~5.5V
Terminal Position DUAL
Supply Voltage 5V
JESD-30 Code R-PDIP-T28
Function Asynchronous
Current - Supply (Max) 60mA
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 4.5V
Memory Size 4.5K 512 x 9
Access Time 20ns
Data Rate 33MHz
Organization 512X9
Memory Width 9
Memory Density 4608 bit
Parallel/Serial PARALLEL
Retransmit Capability Yes
Programmable Flags Support No
Output Enable NO
Expansion Type Depth, Width
Cycle Time 30 ns
RoHS Status ROHS3 Compliant

QS7201-20P Overview


In this case, it is packaged in case number Bulk .There is a 4.5K 512 x 9 MB memory on the FIFO chips, which can be used to store both applications and data.It is recommended that the temperature of the system be regulated to 0°C~70°C for reliable operation.A mounting type of Through Hole is associated with the FIFO memory.This FIFO products operates at 4.5V~5.5V volts.60mA is memory IC's maximum operating supply current.High efficiency is possible with a supply voltage of 5V .FIFO consists of 28 terminations, which indicates that FIFO means is empty.This gadget can also generate RETRANSMIT .Vsup is set to 5.5V (FIFO memory IC's maximum supply voltage).The supply voltage (Vsup) should remain above 4.5V to ensure normal operation.

QS7201-20P Features


4.5K 512 x 9 memory size

QS7201-20P Applications


There are a lot of Rochester Electronics, LLC QS7201-20P FIFOs Memory applications.

  • Industrial Systems
  • Video time base correction
  • Microprogramming
  • Thermal Management for DDR3 Memory Modules
  • Networking
  • Data
  • Analog-to-digital converters
  • Consumer Systems
  • Video Processing
  • Cameras

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