Parameters |
Mounting Type |
Surface Mount |
Surface Mount |
YES |
Operating Temperature |
0°C~70°C |
Packaging |
Bulk |
JESD-609 Code |
e0 |
Pbfree Code |
no |
Part Status |
Obsolete |
Number of Terminations |
32 |
Terminal Finish |
TIN LEAD |
Technology |
CMOS |
Terminal Position |
QUAD |
Terminal Form |
J BEND |
Supply Voltage |
5V |
JESD-30 Code |
R-PQCC-J32 |
Function |
Synchronous |
Qualification Status |
COMMERCIAL |
Supply Voltage-Max (Vsup) |
5.5V |
Supply Voltage-Min (Vsup) |
4.5V |
Memory Size |
18K 2K x 9 |
Access Time |
10ns |
Organization |
2KX9 |
Memory Width |
9 |
Memory Density |
18432 bit |
Parallel/Serial |
PARALLEL |
Retransmit Capability |
No |
Programmable Flags Support |
Yes |
Output Enable |
YES |
Cycle Time |
15 ns |
RoHS Status |
ROHS3 Compliant |
QS72231-15JR Overview
Bulk case is used for packaging.Apps and data can be stored in the 18K 2K x 9 memory of the FIFO chip.The temperature should be adjusted to 0°C~70°C in order to ensure reliable operation.The FIFO memory's mounting type is Surface Mount .When the supply voltage is 5V there is the possibility of high efficiency.FIFO means contains a total of 32 terminations.In this case, the FIFO memory IC's maximum supply voltage is set to 5.5V .Ideally, the supply voltage (Vsup) should stay above 4.5V .
QS72231-15JR Features
18K 2K x 9 memory size
QS72231-15JR Applications
There are a lot of Rochester Electronics, LLC QS72231-15JR FIFOs Memory applications.
- MP3 Interface for Automobile
- Portable Information Devices
- Buses
- Tape controllers
- Product traceability
- Portable Information Devices
- Consumer
- Seismic Data Collection at Extreme Temperatures
- Data communications
- SPI Bus Flash Memory Device