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QS723620-25PF

132 TerminationsFIFO memory IC36K 1K x 3616ns


  • Manufacturer: Rochester Electronics, LLC
  • Nocochips NO: 699-QS723620-25PF
  • Package: 132-QFP
  • Datasheet: -
  • Stock: 757
  • Description: 132 TerminationsFIFO memory IC36K 1K x 3616ns (Kg)

Details

Tags

Parameters
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Bulk
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Number of Terminations 132
Terminal Finish TIN LEAD
Additional Feature RETRANSMIT; PARITY GENERATOR/CHECKER; MAILBOX
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Supply Voltage 5V
JESD-30 Code S-PQFP-G132
Function Synchronous
Qualification Status COMMERCIAL
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 4.5V
Memory Size 36K 1K x 36
Access Time 16ns
Organization 1KX36
Memory Width 36
Memory Density 36864 bit
Parallel/Serial PARALLEL
FWFT Support No
Programmable Flags Support Yes
Output Enable YES
Cycle Time 25 ns
RoHS Status ROHS3 Compliant
Mounting Type Surface Mount
Package / Case 132-QFP

QS723620-25PF Overview


You can find FIFO memory chip in the 132-QFP package.In terms of packaging, it comes in Bulk cases.There is a memory of 36K 1K x 36 on the FIFO chip that can be used to store applications and data.It is recommended that the temperature be regulated to 0°C~70°C to ensure reliable operation.The FIFO memory's mounting type is Surface Mount .When the supply voltage is 5V there is the possibility of high efficiency.A total of 132 terminations can be found in FIFO means.It is also possible to generate RETRANSMIT; PARITY GENERATOR/CHECKER; MAILBOX with the use of this FIFO memory.A FIFO memory IC's maximum supply voltage of 5.5V is set for Vsup.Keep the supply voltage (Vsup) above 4.5V for normal operation.

QS723620-25PF Features


36K 1K x 36 memory size

QS723620-25PF Applications


There are a lot of Rochester Electronics, LLC QS723620-25PF FIFOs Memory applications.

  • Queues for communication systems
  • Application that requires re-writable nonvolatile parameter memory
  • One assembly
  • Portable Information Devices
  • Fabrication Site
  • Controlled baseline
  • Programmable Logic Controller
  • Address mapping
  • Buses
  • Firmware loaders

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