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R8A77610DA01BGV#YF

System On Chip


  • Manufacturer: Renesas Electronics America
  • Nocochips NO: 668-R8A77610DA01BGV#YF
  • Package: 449-BGA
  • Datasheet: -
  • Stock: 239
  • Description: System On Chip(Kg)

Details

Tags

Parameters
Package / Case 449-BGA
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Speed 400MHz
RAM Size 16KB
Core Processor SH-4A
Peripherals DDR
Connectivity CANbus, I2C, SCI, SD, SSI, USB
Architecture MPU
RoHS Status ROHS3 Compliant

This SoC is built on SH-4A core processor(s).


Based on the core processor(s) SH-4A, this SoC is built.It has been assigned a package 449-BGA by its manufacturer for this system on a chip.As this SoC chip has 16KB RAM implemented, it provides reliable performance to its users.A MPU technique is used for the SoC design's internal architecture.There is a state-of-the-art Tray package that houses this SoC system on a chip.

SH-4A processor.


16KB RAM.
Built on MPU.

There are a lot of Renesas Electronics America


R8A77610DA01BGV#YF System On Chip (SoC) applications.

  • Special Issue Editors
  • POS Terminals
  • Defense
  • AC-input BLDC motor drive
  • Central alarm system
  • Multiprocessor system-on-chips (MPSoCs)
  • Industrial AC-DC
  • Central inverter
  • Mobile computing
  • Functional safety for critical applications in the industrial sectors

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