Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | SOD-882 |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2013 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Max Operating Temperature | 150°C |
Min Operating Temperature | -55°C |
Terminal Position | BOTTOM |
Pin Count | 2 |
Reference Standard | AEC-Q101; IEC-60134 |
Number of Elements | 1 |
Power Dissipation-Max | 0.315W |
Element Configuration | Single |
Speed | Small Signal =< 200mA (Io), Any Speed |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 500nA @ 10V |
Voltage - Forward (Vf) (Max) @ If | 450mV @ 10mA |
Forward Current | 200mA |
Operating Temperature - Junction | 150°C Max |
Forward Voltage | 640mV |
Max Reverse Voltage (DC) | 30V |
Average Rectified Current | 200mA |
Max Repetitive Reverse Voltage (Vrrm) | 30V |
Peak Non-Repetitive Surge Current | 3A |
Natural Thermal Resistance | 70 °C/W |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |