Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | SC-79, SOD-523 |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2009 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Max Operating Temperature | 150°C |
Min Operating Temperature | -55°C |
Terminal Position | DUAL |
Terminal Form | FLAT |
Base Part Number | RB521S30 |
Pin Count | 2 |
Reference Standard | AEC-Q101; IEC-60134 |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Small Signal =< 200mA (Io), Any Speed |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 30μA @ 10V |
Power Dissipation | 275mW |
Voltage - Forward (Vf) (Max) @ If | 500mV @ 200mA |
Forward Current | 200mA |
Operating Temperature - Junction | 150°C Max |
Max Surge Current | 1A |
Application | EFFICIENCY |
Forward Voltage | 500mV |
Max Reverse Voltage (DC) | 30V |
Average Rectified Current | 200mA |
Number of Phases | 1 |
Peak Reverse Current | 2.5μA |
Max Repetitive Reverse Voltage (Vrrm) | 30V |
Capacitance @ Vr, F | 25pF @ 1V 1MHz |
Peak Non-Repetitive Surge Current | 1A |
Reverse Voltage | 30V |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |