banner_page

RE-100H-200-30

THERMAL INTERFACE PAD, GAP PAD,


  • Manufacturer: Taica North America Corporation
  • Nocochips NO: 771-RE-100H-200-30
  • Package: -
  • Datasheet: PDF
  • Stock: 653
  • Description: THERMAL INTERFACE PAD, GAP PAD, (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Material Silicone Gel
Shape Square
Series λGEL™ RE
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Gel Pad, Sheet
Color Black
Adhesive Adhesive - One Side
Outline 200.00mm x 200.00mm
Thermal Conductivity 2.0W/m-K
Thickness 0.118 3.00mm
RoHS Status RoHS Compliant
See Relate Datesheet

Write a review

Note: HTML is not translated!
    Bad           Good