RPI-130
| Parameters | |
|---|---|
| Contact Plating | Copper, Silver, Tin |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | Module, PC Pins, Slot Type |
| Operating Temperature | -25°C~85°C |
| Packaging | Bulk |
| Published | 2008 |
| JESD-609 Code | e2 |
| Pbfree Code | yes |
| Part Status | Not For New Designs |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Unamplified |
| Terminal Finish | Tin/Copper (Sn/Cu) |
| Number of Functions | 1 |
| Output Configuration | Transistor |
| Power Dissipation | 80mW |
| Rise Time | 10μs |
| Fall Time (Typ) | 10 μs |
| Collector Emitter Voltage (VCEO) | 30V |
| Max Collector Current | 30mA |
| Sensing Distance | 0.047 (1.2mm) |
| Collector Emitter Breakdown Voltage | 30V |
| Forward Current-Max | 0.05A |
| Current - Collector (Ic) (Max) | 30mA |
| Wavelength | 850 nm |
| Current - DC Forward (If) (Max) | 50mA |
| On-State Current-Max | 0.01A |
| Dark Current-Max | 100nA |
| Slot Width-Nom | 1.2mm |
| Gap Size | 1.2mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
See Relate Datesheet
