Parameters | |
---|---|
Package / Case | 3-SMD, Flat Lead |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | 150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 1999 |
JESD-609 Code | e2 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Terminal Finish | TIN COPPER |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 10 |
Pin Count | 3 |
Number of Elements | 1 |
Power Dissipation-Max | 320mW Ta |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 800mW |
Turn On Delay Time | 7 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 54m Ω @ 2.5A, 4.5V |
Vgs(th) (Max) @ Id | 1.3V @ 1mA |
Input Capacitance (Ciss) (Max) @ Vds | 370pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 2.5A Ta |
Gate Charge (Qg) (Max) @ Vgs | 5nC @ 4.5V |
Rise Time | 15ns |
Drive Voltage (Max Rds On,Min Rds On) | 1.5V 4.5V |
Vgs (Max) | ±10V |
Fall Time (Typ) | 15 ns |
Turn-Off Delay Time | 35 ns |
Continuous Drain Current (ID) | 2.5A |
Threshold Voltage | 300mV |
Gate to Source Voltage (Vgs) | 10V |
Drain-source On Resistance-Max | 0.068Ohm |
Drain to Source Breakdown Voltage | 20V |
Nominal Vgs | 300 mV |
Height | 820μm |
Length | 2.1mm |
Width | 1.8mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |