Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 3-SMD, No Lead |
Transistor Element Material | SILICON |
Operating Temperature | 150°C TJ |
Packaging | Cut Tape (CT) |
Published | 2016 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Subcategory | Other Transistors |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XBCC-N3 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE AND RESISTOR |
Power Dissipation-Max | 100mW Ta |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 100mW |
Case Connection | DRAIN |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 3.8 Ω @ 100mA, 4.5V |
Vgs(th) (Max) @ Id | 1V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds | 15pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 100mA Ta |
Rise Time | 62ns |
Drain to Source Voltage (Vdss) | 20V |
Drive Voltage (Max Rds On,Min Rds On) | 1.2V 4.5V |
Vgs (Max) | ±10V |
Fall Time (Typ) | 137 ns |
Turn-Off Delay Time | 325 ns |
Continuous Drain Current (ID) | 100mA |
Drain Current-Max (Abs) (ID) | 0.1A |
Drain to Source Breakdown Voltage | -20V |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |