Parameters |
Mounting Type |
Surface Mount |
Package / Case |
156-LBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~70°C |
Packaging |
Tape & Reel (TR) |
Published |
2001 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
156 |
Type |
Video, HD |
HTS Code |
8542.39.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Number of Functions |
1 |
Terminal Pitch |
1mm |
Base Part Number |
SAA7109 |
Pin Count |
156 |
JESD-30 Code |
S-PBGA-B156 |
Supply Voltage-Max (Vsup) |
3.45V |
Supply Voltage-Min (Vsup) |
3.15V |
Data Interface |
Serial |
Voltage - Supply, Analog |
3.15V~3.45V |
Voltage - Supply, Digital |
3V~3.6V |
Resolution (Bits) |
9, 10 b |
Sigma Delta |
No |
Number of ADCs / DACs |
3 / 2 |
Height Seated (Max) |
1.75mm |
Length |
15mm |
Width |
15mm |
RoHS Status |
ROHS3 Compliant |
SAA7109E/V1,518 Overview
As a space saver, it comes in the 156-LBGA package. As a packaging method, Tape & Reel (TR) is adopted. In numerous applications, this electronic part can deliver high-efficiency performance as a type of Video, HD. As a mounting type, it uses Surface Mount. At 0°C~70°C, it can operate normally. It is integrated with 3 / 2 ADCs / DACs. The analog circuit is provided with the supply voltage of 3.15V~3.45V. It receives a voltage of 3V~3.6V as its supply voltage. In order to prevent signal reflections from off the end of the transmission line, 156 terminations are used. It is configured with 156 pins. Its base part number SAA7109 can be used to find more related items. There is a minimum supply voltage of 3.15V supported by it. Supply voltages up to 3.45V are supported.
SAA7109E/V1,518 Features
Embedded in the 156-LBGA package
Operating temperature of 0°C~70°C
3 / 2 ADCs / DACs
SAA7109E/V1,518 Applications
There are a lot of NXP USA Inc. SAA7109E/V1,518 CODECs Interface ICs applications.
- Filling
- Radiation therapy
- Switching function
- Dynamic applications
- Microprocessor
- Position measurement
- Half adders
- Metal forming & fabrication
- Multiplication
- Dimensionality reduction