Parameters | |
---|---|
Mounting Type | Surface Mount |
Package / Case | 8-SMD, Flat Lead |
Surface Mount | YES |
Number of Pins | 8 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2012 |
JESD-609 Code | e6 |
Pbfree Code | yes |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Bismuth (Sn/Bi) |
Max Operating Temperature | 125°C |
Min Operating Temperature | -55°C |
Pin Count | 8 |
Number of Elements | 2 |
Element Configuration | Dual |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 7.5μA @ 15V |
Voltage - Forward (Vf) (Max) @ If | 620mV @ 2A |
Forward Current | 2A |
Max Reverse Leakage Current | 7.5μA |
Operating Temperature - Junction | -55°C~125°C |
Max Surge Current | 20A |
Output Current-Max | 1.5A |
Application | GENERAL PURPOSE |
Forward Voltage | 620mV |
Max Reverse Voltage (DC) | 30V |
Average Rectified Current | 2A |
Number of Phases | 1 |
Reverse Recovery Time | 10 ns |
Max Repetitive Reverse Voltage (Vrrm) | 30V |
Peak Non-Repetitive Surge Current | 20A |
Diode Configuration | 2 Independent |
Max Forward Surge Current (Ifsm) | 20A |
Radiation Hardening | No |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |