Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 4-VDFN |
Number of Pins | 4 |
Diode Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2015 |
JESD-609 Code | e3 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 4 |
ECCN Code | EAR99 |
Additional Feature | HIGH RELIABILITY |
Technology | Schottky |
Terminal Position | BOTTOM |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | 260 |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | 30 |
Reference Standard | AEC-Q101 |
Number of Elements | 4 |
Diode Type | Single Phase |
Current - Reverse Leakage @ Vr | 1mA @ 30V |
Voltage - Forward (Vf) (Max) @ If | 420mV @ 1A |
Forward Current | 1A |
Output Current-Max | 1A |
Forward Voltage | 210mV |
Number of Phases | 1 |
Peak Reverse Current | 1mA |
Max Repetitive Reverse Voltage (Vrrm) | 30V |
Peak Non-Repetitive Surge Current | 50A |
Height | 950μm |
Length | 6.2mm |
Width | 4.75mm |
RoHS Status | ROHS3 Compliant |