Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 2-SMD, Flat Lead |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2015 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Max Operating Temperature | 150°C |
Min Operating Temperature | -55°C |
Additional Feature | LOW LEAKAGE CURRENT |
HTS Code | 8541.10.00.80 |
Capacitance | 115pF |
Max Power Dissipation | 830mW |
Terminal Position | BOTTOM |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XBCC-N2 |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 150μA @ 20V |
Voltage - Forward (Vf) (Max) @ If | 470mV @ 2A |
Case Connection | ANODE |
Forward Current | 2A |
Operating Temperature - Junction | -55°C~150°C |
Output Current-Max | 2A |
Application | EFFICIENCY |
Forward Voltage | 470mV |
Max Reverse Voltage (DC) | 20V |
Average Rectified Current | 2A |
Number of Phases | 1 |
Peak Reverse Current | 150μA |
Max Repetitive Reverse Voltage (Vrrm) | 20V |
Capacitance @ Vr, F | 115pF @ 4V 1MHz |
Max Forward Surge Current (Ifsm) | 20A |
RoHS Status | ROHS3 Compliant |