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SF-1206S800W-2

Fuse Chip Slow Blow Acting 8A 32V SMD Solder Pad 1206 3.2 X 1.6 X 1.08mm T/R


  • Manufacturer: Bourns Inc.
  • Nocochips NO: 103-SF-1206S800W-2
  • Package: 1206 (3216 Metric), Concave
  • Datasheet: PDF
  • Stock: 160
  • Description: Fuse Chip Slow Blow Acting 8A 32V SMD Solder Pad 1206 3.2 X 1.6 X 1.08mm T/R(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Surface Mount
Package / Case 1206 (3216 Metric), Concave
Surface Mount YES
Terminal Shape WRAPAROUND
Operating Temperature -55°C~125°C
Packaging Tape & Reel (TR)
Series SinglFuse™ SF-1206SxxxW
Size / Dimension 0.126Lx0.063W x 0.043 H 3.20mmx1.60mmx1.10mm
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Additional Feature PRE ARCING TIME: OPEN WITHIN 5 SEC AT 250% RATED CURRENT
Voltage - Rated DC 32V
Current Rating (Amps) 8A
Packing Method TR, 7 INCH
Base Part Number SF-1206
Reference Standard UL
Approval Agency UL
Body Length or Diameter 3.2mm
Body Breadth 1.6 mm
Physical Dimension 3.2mm x 1.6mm x 1.08mm
Response Time Slow Blow
Fuse Type Board Mount (Cartridge Style Excluded)
Breaking Capacity @ Rated Voltage 50A
Rated Current 8A
Melting I2t 13.5
DC Cold Resistance 0.0084Ohm
Circuit Protection Type ELECTRIC FUSE
Joule Integral-Nom 13 J
Body Height 1.08mm
RoHS Status ROHS3 Compliant
See Relate Datesheet

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