Parameters | |
---|---|
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Pin Count | 3 |
Number of Elements | 1 |
Number of Channels | 1 |
Power Dissipation-Max | 280mW Ta |
Factory Lead Time | 1 Week |
Element Configuration | Single |
Mount | Surface Mount |
Operating Mode | ENHANCEMENT MODE |
Turn On Delay Time | 5 ns |
Mounting Type | Surface Mount |
FET Type | N-Channel |
Package / Case | SC-70, SOT-323 |
Rds On (Max) @ Id, Vgs | 480m Ω @ 600mA, 10V |
Number of Pins | 3 |
Vgs(th) (Max) @ Id | 3V @ 250μA |
Current - Continuous Drain (Id) @ 25°C | 600mA Ta |
Weight | 6.208546mg |
Gate Charge (Qg) (Max) @ Vgs | 1.4nC @ 10V |
Rise Time | 8ns |
Transistor Element Material | SILICON |
Drain to Source Voltage (Vdss) | 30V |
Operating Temperature | -55°C~150°C TJ |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Packaging | Tape & Reel (TR) |
Fall Time (Typ) | 7 ns |
Published | 2016 |
Turn-Off Delay Time | 8 ns |
Continuous Drain Current (ID) | 600mA |
Series | TrenchFET® |
JESD-609 Code | e3 |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 0.6A |
Drain-source On Resistance-Max | 0.48Ohm |
Pbfree Code | yes |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |