Parameters | |
---|---|
Drive Voltage (Max Rds On,Min Rds On) | 4.5V |
Vgs (Max) | ±8V |
Fall Time (Typ) | 35 ns |
Turn-Off Delay Time | 50 ns |
Continuous Drain Current (ID) | -3A |
Threshold Voltage | -900mV |
Factory Lead Time | 1 Week |
Gate to Source Voltage (Vgs) | 8V |
Contact Plating | Tin |
Drain-source On Resistance-Max | 0.05Ohm |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Drain to Source Breakdown Voltage | -12V |
Package / Case | TO-236-3, SC-59, SOT-23-3 |
Number of Pins | 3 |
Weight | 1.437803g |
Nominal Vgs | -900 mV |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2013 |
Height | 1.02mm |
Series | TrenchFET® |
JESD-609 Code | e3 |
Pbfree Code | yes |
Length | 3.04mm |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Width | 1.4mm |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Radiation Hardening | No |
Subcategory | Other Transistors |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
REACH SVHC | Unknown |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
RoHS Status | ROHS3 Compliant |
Time@Peak Reflow Temperature-Max (s) | 30 |
Pin Count | 3 |
Number of Elements | 1 |
Number of Channels | 1 |
Voltage | 12V |
Power Dissipation-Max | 750mW Ta |
Element Configuration | Single |
Current | 3A |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 750mW |
Turn On Delay Time | 15 ns |
FET Type | P-Channel |
Rds On (Max) @ Id, Vgs | 50m Ω @ 3.85A, 4.5V |
Vgs(th) (Max) @ Id | 900mV @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 715pF @ 6V |
Current - Continuous Drain (Id) @ 25°C | 3A Ta |
Gate Charge (Qg) (Max) @ Vgs | 15nC @ 4.5V |
Rise Time | 35ns |