Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
42-VFQFN Exposed Pad |
Surface Mount |
YES |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Published |
2014 |
Series |
ProSLIC® |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
42 |
Power (Watts) |
750mW |
Voltage - Supply |
3.13V~3.47V |
Terminal Position |
BOTTOM |
Terminal Form |
BUTT |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
3.3V |
Terminal Pitch |
0.5mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
R-XBCC-B42 |
Function |
Subscriber Line Interface Concept (SLIC), CODEC |
Operating Supply Voltage |
3.3V |
Interface |
ISI |
Number of Circuits |
1 |
Telecom IC Type |
TELECOM CIRCUIT |
Height Seated (Max) |
0.9mm |
Length |
7mm |
Width |
5mm |
RoHS Status |
RoHS Compliant |
SI32175-C-GM1 Overview
Board space can be saved by using the 42-VFQFN Exposed Pad package.The way of Tray is employed for telecommunications equipment packing.Mounting type Surface Mount is used.1 circuits make up this telecom IC .3.13V~3.47V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.Telecom switching is possible to achieve reliable performance when the operating temperature is set at -40°C~85°C.Telecom switching configuration contains 42 terminations.It operates at voltage 3.3V.The type of telecom IC it uses is TELECOM CIRCUIT.The supply voltage of 3.3V enables designers to have a great deal of flexibility.There are many similar functions of the telecommunication product that it can provide with the electronic components under the ProSLIC? series.
SI32175-C-GM1 Features
Available in the 42-VFQFN Exposed Pad package
TELECOM CIRCUIT as telecom IC type
Operating supply voltage of 3.3V
SI32175-C-GM1 Applications
There are a lot of Silicon Labs SI32175-C-GM1 Telecom applications.
- Fiber to the Home (FTTH)
- PBX (Private Branch Exchange)
- Fiber In The Loop (FITL)
- ATM Switches
- Integrated Multi-Service Access Platforms (IMAPs)
- High-Density T1/E1/J1 interfaces for Multiplexers
- ATM equipment with integrated DS1 interfaces
- E2 Rates PCM Line Interface
- CSU/DSU Equipment
- E1 Rates PCM Line Interface