Parameters |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
64-TQFP |
Packaging |
Tray |
Published |
2015 |
Series |
ProSLIC® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
64 |
Technology |
CMOS |
Voltage - Supply |
3.3V |
Terminal Position |
QUAD |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
3.3V |
Terminal Pitch |
0.5mm |
Time@Peak Reflow Temperature-Max (s) |
40 |
Base Part Number |
SI3226 |
JESD-30 Code |
S-PQFP-G64 |
Function |
Subscriber Line Interface Concept (SLIC), CODEC |
Operating Temperature (Max) |
70°C |
Temperature Grade |
COMMERCIAL |
Interface |
GCI, PCM, SPI |
Number of Circuits |
2 |
Length |
10mm |
Width |
10mm |
RoHS Status |
RoHS Compliant |
SI3226-E-FQ Overview
Saving board space is achieved with the 64-TQFP package.Packing is done according to the Tray method.Mounting type Surface Mount is used.Telecom circuit is made up of 2 circuits.A higher supply voltage for 3.3V will improve efficiency.Mounted in Surface Mount-direction.There are 64 terminations can be found in telecom switching configuration.A 3.3V supply voltage is required to operate it.Telecom switching's base part number of SI3226 can be used to find more related parts.This part can perform many functions similar to the electronic parts under the ProSLIC? series.There is a maximum operating temperature of 70°C supported by telecommunications equipment.
SI3226-E-FQ Features
Available in the 64-TQFP package
SI3226-E-FQ Applications
There are a lot of Silicon Labs SI3226-E-FQ Telecom applications.
- Digital cross connects (DSX-1)
- T1/E1/J1 add/drop multiplexers (MUX)
- High-Density T1/E1/J1 interfaces for Multiplexers
- NIU
- Digital Cross Connect Systems
- M13 MUX
- Voice over packet gateways
- Network Multiplexing and Terminating Equipment
- Home Side Box
- PBX interfaces