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SI32266-C-FM1R

Telecom device1 Circuits


  • Manufacturer: Silicon Labs
  • Nocochips NO: 715-SI32266-C-FM1R
  • Package: QFN
  • Datasheet: -
  • Stock: 700
  • Description: Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mount Surface Mount
Mounting Type Surface Mount
Package / Case QFN
Supplier Device Package 50-QFN (6x8)
Packaging Tape & Reel (TR)
Published 2013
Series ProSLIC®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V
Function Subscriber Line Interface Concept (SLIC), CODEC
Interface GCI, PCM, SPI
Number of Circuits 1
Telecom IC Type DIGITAL SLIC
RoHS Status RoHS Compliant

SI32266-C-FM1R Overview


The QFN package reduces the amount of space on a board.Telecommunications equipment is packed in the Tape & Reel (TR)-way.The mounting type is Surface Mount.Telecom circuit is made up of 1 circuits.Providing 3.3V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.Surface Mount is the way telecom switching is mounted.It adopts DIGITAL SLIC as its telecom IC type.The ProSLIC? series is capable of providing a number of similar functions to the W series.

SI32266-C-FM1R Features


Available in the QFN package
DIGITAL SLIC as telecom IC type

SI32266-C-FM1R Applications


There are a lot of Silicon Labs SI32266-C-FM1R Telecom applications.

  • Digital access cross connects
  • T1 Digital Cross Connects (DSX-1)
  • E1 Multiplexer
  • Integrated Access Devices (IADs)
  • T1/E1/J1 add/drop multiplexers (MUX)
  • Public switching systems
  • E2 Rates PCM Line Interface
  • Multichannel DS1 Test Equipment
  • Digital loop carrier (DLC)
  • T1/E1/J1 LAN/WAN Routers

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