SI32266-C-FMR
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | QFN |
| Supplier Device Package | 50-QFN (6x8) |
| Packaging | Tape & Reel (TR) |
| Series | ProSLIC® |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.3V |
| Function | Subscriber Line Interface Concept (SLIC), CODEC |
| Interface | GCI, PCM, SPI |
| Number of Circuits | 1 |
| Telecom IC Type | DIGITAL SLIC |
| RoHS Status | RoHS Compliant |
SI32266-C-FMR Overview
A QFN package saves space on a board.Packing is done according to the Tape & Reel (TR) method.Telecommunications equipment is mounted using Surface Mount.1 circuits make up this telecom IC .Wtelecom IC's efficiencyh a high supply voltage, 3.3V can be operated more efficiently.Mounted in the direction of Surface Mount.The telecom IC type is DIGITAL SLIC.A number of similar functions of the telecommunication product can be provided by it as with those of electronic parts under the ProSLIC? series.
SI32266-C-FMR Features
Available in the QFN package
DIGITAL SLIC as telecom IC type
SI32266-C-FMR Applications
There are a lot of Silicon Labs SI32266-C-FMR Telecom applications.
- Frame Relay Switches and Access Devices (FRADS)
- Channel Service Units (CSUs): T1/E1/J1
- SONET/SDH terminal
- ISDN Primary Rate Interfaces (PRA)
- NIU
- Home Gateway
- Microwave transmission systems
- ATM equipment with integrated DS1 interfaces
- Cable Modem
- Integrated Multi-Service Access Platforms (IMAPs)
