SI32266-C-GM1R
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | QFN |
| Supplier Device Package | 50-QFN (6x8) |
| Packaging | Tape & Reel (TR) |
| Published | 2000 |
| Series | ProSLIC® |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.3V |
| Function | Subscriber Line Interface Concept (SLIC), CODEC |
| Interface | GCI, PCM, SPI |
| Number of Circuits | 1 |
| Telecom IC Type | DIGITAL SLIC |
| RoHS Status | RoHS Compliant |
SI32266-C-GM1R Overview
Space is saved on the board by using the QFN package.Telecommunications equipment is packed according to Tape & Reel (TR)'s method.In this case, Surface Mount is the mounting type.An 1-circuit makes up this telecom IC .When 3.3V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.Surface Mount is the way telecom switching is mounted.Telecom ICs are of type DIGITAL SLIC.A number of similar functions of the telecommunication product can be provided by it as with those of electronic parts under the ProSLIC? series.
SI32266-C-GM1R Features
Available in the QFN package
DIGITAL SLIC as telecom IC type
SI32266-C-GM1R Applications
There are a lot of Silicon Labs SI32266-C-GM1R Telecom applications.
- E3/DS3 Access Equipment
- T1/E1/J1 LAN/WAN Routers
- Fiber
- Interfaces to E3
- Private branch exchange (PBX)
- Interfaces to DS3
- Set-Top Box
- High-Density T1/E1/J1 interfaces for Multiplexers
- ISDN Primary Rate Interfaces (PRA)
- DECT (Digital European Cordless Telephone) Base
