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SI32266-C-GMR

Telecom device1 Circuits


  • Manufacturer: Silicon Labs
  • Nocochips NO: 715-SI32266-C-GMR
  • Package: QFN
  • Datasheet: -
  • Stock: 755
  • Description: Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Mount Surface Mount
Mounting Type Surface Mount
Package / Case QFN
Supplier Device Package 50-QFN (6x8)
Packaging Tape & Reel (TR)
Series ProSLIC®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V
Function Subscriber Line Interface Concept (SLIC), CODEC
Interface GCI, PCM, SPI
Number of Circuits 1
Telecom IC Type DIGITAL SLIC
RoHS Status RoHS Compliant

SI32266-C-GMR Overview


Saving board space is achieved with the QFN package.Telecommunications equipment is packed using the Tape & Reel (TR) method.Surface Mount is used as telecommunications equipment mounting type.A 1 circuit is the heart of this telecom IC .When 3.3V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.The mounting is in the way of Surface Mount.The type of telecom IC it uses is DIGITAL SLIC.A lot of its functions of the telecommunication product are similar to those of the electronic parts in the ProSLIC? series.

SI32266-C-GMR Features


Available in the QFN package
DIGITAL SLIC as telecom IC type

SI32266-C-GMR Applications


There are a lot of Silicon Labs SI32266-C-GMR Telecom applications.

  • T1/E1/J1 Performance Monitoring
  • Home Side Box
  • E1 Multiplexer
  • E2 Rates PCM Line Interface
  • Fiber
  • Central office (CO)
  • Digital Cross-connect Systems (DCS)
  • Cable PC
  • ISDN NT1/TA
  • Integrated Multi-Service Access Platforms (IMAPs)

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