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SI32267-C-GMR

Telecom device1 Circuits


  • Manufacturer: Silicon Labs
  • Nocochips NO: 715-SI32267-C-GMR
  • Package: QFN
  • Datasheet: -
  • Stock: 510
  • Description: Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Mount Surface Mount
Mounting Type Surface Mount
Package / Case QFN
Supplier Device Package 50-QFN (6x8)
Packaging Tape & Reel (TR)
Series ProSLIC®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V
Function Subscriber Line Interface Concept (SLIC), CODEC
Interface GCI, PCM, SPI
Number of Circuits 1
Telecom IC Type DIGITAL SLIC
RoHS Status RoHS Compliant

SI32267-C-GMR Overview


A QFN package is used to reduce board space requirements.Telecommunications equipment is packed in the Tape & Reel (TR)-way.The mounting type is Surface Mount.1 circuits make up this telecom IC .Telecom circuit is possible to increase efficiency by providing 3.3V with a higher voltage.Telecom switching is mounted in a Surface Mount-direction.It adopts DIGITAL SLIC as its telecom IC type.The ProSLIC? series is capable of providing a number of similar functions to the W series.

SI32267-C-GMR Features


Available in the QFN package
DIGITAL SLIC as telecom IC type

SI32267-C-GMR Applications


There are a lot of Silicon Labs SI32267-C-GMR Telecom applications.

  • PBX interfaces
  • Fault Tolerant Systems
  • Digital Cross Connect Systems
  • DECT (Digital European Cordless Telephone) Base
  • Home Side Box
  • Private branch exchange (PBX)
  • Digital Cross-connect Systems (DCS)
  • T1/E1/J1 Multiplexer and Channel Banks
  • Voice over packet gateways
  • Interfaces to E3

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