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SI32268-C-FM1R

Telecom device1 Circuits


  • Manufacturer: Silicon Labs
  • Nocochips NO: 715-SI32268-C-FM1R
  • Package: QFN
  • Datasheet: -
  • Stock: 668
  • Description: Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mount Surface Mount
Mounting Type Surface Mount
Package / Case QFN
Supplier Device Package 50-QFN (6x8)
Packaging Tape & Reel (TR)
Published 2000
Series ProSLIC®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V
Function Subscriber Line Interface Concept (SLIC), CODEC
Interface GCI, PCM, SPI
Number of Circuits 1
Telecom IC Type DIGITAL SLIC
RoHS Status RoHS Compliant

SI32268-C-FM1R Overview


In order to save space on the board, QFN packages are used.A Tape & Reel (TR)-packing method is used to pack telecommunications equipment.The mounting type of this telecom circuit is Surface Mount.This telecom IC is composed of 1 circuits.When 3.3V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.In Surface Mount's direction, telecom switching is mounted.It uses a DIGITAL SLIC type telecom IC.The ProSLIC? series is capable of providing a number of similar functions to the W series.

SI32268-C-FM1R Features


Available in the QFN package
DIGITAL SLIC as telecom IC type

SI32268-C-FM1R Applications


There are a lot of Silicon Labs SI32268-C-FM1R Telecom applications.

  • ATM equipment with integrated DS1 interfaces
  • DECT (Digital European Cordless Telephone) Base Stations
  • Voice over packet gateways
  • Digital loop carrier (DLC)
  • PBX (Private Branch Exchange)
  • E2 Rates PCM Line Interface
  • Multi-Line E1 Interface Cards
  • T3 channelized access concentrators
  • Cable modem
  • Digital Cross Connect Systems

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