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SI32268-C-GM1

Telecom device1 Circuits


  • Manufacturer: Silicon Labs
  • Nocochips NO: 715-SI32268-C-GM1
  • Package: QFN
  • Datasheet: -
  • Stock: 201
  • Description: Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mount Surface Mount
Mounting Type Surface Mount
Package / Case QFN
Supplier Device Package 50-QFN (6x8)
Packaging Tray
Published 2014
Series ProSLIC®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V
Function Subscriber Line Interface Concept (SLIC), CODEC
Interface GCI, PCM, SPI
Number of Circuits 1
Telecom IC Type DIGITAL SLIC
RoHS Status RoHS Compliant

SI32268-C-GM1 Overview


QFN package is used to save board space.To pack telecommunications equipment, the way of Tray is used.Surface Mount is used as telecommunications equipment mounting type.An 1-circuit makes up this telecom IC .Telecom circuit is possible to increase efficiency by providing 3.3V with a higher voltage.Surface Mount is mounted on telecom switching.Telecom ICs are of type DIGITAL SLIC.This part can perform many functions similar to the electronic parts under the ProSLIC? series.

SI32268-C-GM1 Features


Available in the QFN package
DIGITAL SLIC as telecom IC type

SI32268-C-GM1 Applications


There are a lot of Silicon Labs SI32268-C-GM1 Telecom applications.

  • PCM channel bank
  • Add/Drop multiplexers (ADMs)
  • T1/E1/J1 LAN/WAN Routers
  • E1 LAN/WAN Routers
  • Home Gateway
  • CSU/DSU E1/T1/J1 Interface
  • CSU/DSU Equipment
  • Inverse Multiplexing for ATM (IMA)
  • Channel Banks
  • Central office (CO)

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