Parameters |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
QFN |
Supplier Device Package |
50-QFN (6x8) |
Packaging |
Tray |
Published |
2014 |
Series |
ProSLIC® |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
3.3V |
Function |
Subscriber Line Interface Concept (SLIC), CODEC |
Interface |
GCI, PCM, SPI |
Number of Circuits |
1 |
Telecom IC Type |
DIGITAL SLIC |
RoHS Status |
RoHS Compliant |
SI32268-C-GM1 Overview
QFN package is used to save board space.To pack telecommunications equipment, the way of Tray is used.Surface Mount is used as telecommunications equipment mounting type.An 1-circuit makes up this telecom IC .Telecom circuit is possible to increase efficiency by providing 3.3V with a higher voltage.Surface Mount is mounted on telecom switching.Telecom ICs are of type DIGITAL SLIC.This part can perform many functions similar to the electronic parts under the ProSLIC? series.
SI32268-C-GM1 Features
Available in the QFN package
DIGITAL SLIC as telecom IC type
SI32268-C-GM1 Applications
There are a lot of Silicon Labs SI32268-C-GM1 Telecom applications.
- PCM channel bank
- Add/Drop multiplexers (ADMs)
- T1/E1/J1 LAN/WAN Routers
- E1 LAN/WAN Routers
- Home Gateway
- CSU/DSU E1/T1/J1 Interface
- CSU/DSU Equipment
- Inverse Multiplexing for ATM (IMA)
- Channel Banks
- Central office (CO)