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SI32269-C-FM1

Telecom device1 Circuits


  • Manufacturer: Silicon Labs
  • Nocochips NO: 715-SI32269-C-FM1
  • Package: QFN
  • Datasheet: -
  • Stock: 514
  • Description: Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mount Surface Mount
Mounting Type Surface Mount
Package / Case QFN
Supplier Device Package 50-QFN (6x8)
Packaging Tray
Published 1993
Series ProSLIC®
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V
Function Subscriber Line Interface Concept (SLIC), CODEC
Interface GCI, PCM, SPI
Number of Circuits 1
Telecom IC Type DIGITAL SLIC
RoHS Status RoHS Compliant

SI32269-C-FM1 Overview


The QFN package reduces the amount of space on a board.The way of Tray is employed for telecommunications equipment packing.The mounting type of this telecom circuit is Surface Mount.A 1-circuit composes this telecom IC .3.3V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.Mounted in Surface Mount-direction.It uses a DIGITAL SLIC type telecom IC.This part can perform many functions similar to the electronic parts under the ProSLIC? series.

SI32269-C-FM1 Features


Available in the QFN package
DIGITAL SLIC as telecom IC type

SI32269-C-FM1 Applications


There are a lot of Silicon Labs SI32269-C-FM1 Telecom applications.

  • E2 Rates PCM Line Interface
  • Digital access cross connects
  • T1/E1/J1 LAN/WAN Routers
  • Intelligent PBX
  • Network Multiplexing and Terminating Equipment
  • Residential Gateways
  • SDH Multiplexers
  • Fiber to the Home (FTTH)
  • Short/Medium Loop
  • Add/Drop multiplexers (ADMs)

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