Parameters |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
QFN |
Supplier Device Package |
50-QFN (6x8) |
Packaging |
Tray |
Published |
1993 |
Series |
ProSLIC® |
Part Status |
Not For New Designs |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
3.3V |
Function |
Subscriber Line Interface Concept (SLIC), CODEC |
Interface |
GCI, PCM, SPI |
Number of Circuits |
1 |
Telecom IC Type |
DIGITAL SLIC |
RoHS Status |
RoHS Compliant |
SI32269-C-FM1 Overview
The QFN package reduces the amount of space on a board.The way of Tray is employed for telecommunications equipment packing.The mounting type of this telecom circuit is Surface Mount.A 1-circuit composes this telecom IC .3.3V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.Mounted in Surface Mount-direction.It uses a DIGITAL SLIC type telecom IC.This part can perform many functions similar to the electronic parts under the ProSLIC? series.
SI32269-C-FM1 Features
Available in the QFN package
DIGITAL SLIC as telecom IC type
SI32269-C-FM1 Applications
There are a lot of Silicon Labs SI32269-C-FM1 Telecom applications.
- E2 Rates PCM Line Interface
- Digital access cross connects
- T1/E1/J1 LAN/WAN Routers
- Intelligent PBX
- Network Multiplexing and Terminating Equipment
- Residential Gateways
- SDH Multiplexers
- Fiber to the Home (FTTH)
- Short/Medium Loop
- Add/Drop multiplexers (ADMs)