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SI32269-C-FM1R

Telecom device1 Circuits


  • Manufacturer: Silicon Labs
  • Nocochips NO: 715-SI32269-C-FM1R
  • Package: QFN
  • Datasheet: -
  • Stock: 327
  • Description: Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mount Surface Mount
Mounting Type Surface Mount
Package / Case QFN
Supplier Device Package 50-QFN (6x8)
Packaging Tape & Reel (TR)
Published 2000
Series ProSLIC®
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V
Function Subscriber Line Interface Concept (SLIC), CODEC
Interface GCI, PCM, SPI
Number of Circuits 1
Telecom IC Type DIGITAL SLIC
RoHS Status RoHS Compliant

SI32269-C-FM1R Overview


Board space can be saved by using the QFN package.A Tape & Reel (TR)-packing method is used to pack telecommunications equipment.A Surface Mount-mount is used for mounting the telecom circuit.The telecom IC is composed of 1 circuits.A higher supply voltage for 3.3V will improve efficiency.A Surface Mount-axis mounts telecom switching.It uses the DIGITAL SLIC IC type for its telecom IC.There are many similarities between it and the electronic parts of the ProSLIC? series.

SI32269-C-FM1R Features


Available in the QFN package
DIGITAL SLIC as telecom IC type

SI32269-C-FM1R Applications


There are a lot of Silicon Labs SI32269-C-FM1R Telecom applications.

  • CSU/DSU Equipment
  • PCM channel bank
  • T2 Rates PCM Line Interface
  • E1 Network Equipment
  • Wireless base stations
  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations
  • Stations
  • Wireless local loop (WLL)
  • ISDN Primary Rate Interfaces (PRA)
  • T1/E1/J1 LAN/WAN Routers

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