SI32269-C-FMR
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | QFN |
| Supplier Device Package | 50-QFN (6x8) |
| Packaging | Tape & Reel (TR) |
| Series | ProSLIC® |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.3V |
| Function | Subscriber Line Interface Concept (SLIC), CODEC |
| Interface | GCI, PCM, SPI |
| Number of Circuits | 1 |
| Telecom IC Type | DIGITAL SLIC |
| RoHS Status | RoHS Compliant |
SI32269-C-FMR Overview
The QFN package reduces the amount of space on a board.Telecommunications equipment is packed using the Tape & Reel (TR) method.A Surface Mount-mount is used for mounting the telecom circuit.Telecommunications equipment consists of 1 circuits.3.3V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.The mounting is in the way of Surface Mount.Telecom ICs of type DIGITAL SLIC are used in it.A number of similar functions of the telecommunication product can be provided by it as with those of electronic parts under the ProSLIC? series.
SI32269-C-FMR Features
Available in the QFN package
DIGITAL SLIC as telecom IC type
SI32269-C-FMR Applications
There are a lot of Silicon Labs SI32269-C-FMR Telecom applications.
- T1 Digital Cross Connects (DSX-1)
- T1/E1/J1 Multiplexer and Channel Banks
- Central office
- Fiber
- DECT (Digital European Cordless Telephone) Base Stations
- Channel Service Units (CSUs): T1/E1/J1
- Add/Drop multiplexers (ADMs)
- LAN Routers
- T3 channelized access concentrators
- Digital cross connects (DSX-1)
