Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
56-VFQFN Exposed Pad |
Operating Temperature |
-40°C~85°C |
Packaging |
Tube |
Series |
ProSLIC® |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
3.3V |
Interface |
3-Wire, PCM |
Number of Circuits |
2 |
Telecom IC Type |
DIGITAL SLIC |
RoHS Status |
Non-RoHS Compliant |
SI32286-A-GM Overview
The 56-VFQFN Exposed Pad package reduces the amount of space on a board.A Tube-packing method is used to pack telecommunications equipment.The mounting type of this telecom circuit is Surface Mount.Telecom circuit is made up of 2 circuits.When the voltage for 3.3V is provided, improved efficiency can be achieved.-40°C~85°C is the operating temperature that can be set for reliable performance.Telecom ICs are of type DIGITAL SLIC.There are many similarities between it and the electronic parts of the ProSLIC? series.
SI32286-A-GM Features
Available in the 56-VFQFN Exposed Pad package
DIGITAL SLIC as telecom IC type
SI32286-A-GM Applications
There are a lot of Silicon Labs SI32286-A-GM Telecom applications.
- M13 MUX
- Channel Service Units (CSUs): T1/E1/J1
- T1/E1/J1 add/drop multiplexers (MUX)
- ISDN Primary Rate Interfaces (PRA)
- DSLAMs
- CSU/DSU E1/T1/J1 Interface
- Fiber In The Loop (FITL)
- Multiplexers
- Digital Cross-Connect Systems
- E1 Network Equipment