Parameters |
Mounting Type |
Surface Mount |
Package / Case |
64-TQFP |
Surface Mount |
YES |
Operating Temperature |
0°C~70°C |
Packaging |
Tray |
Published |
1999 |
JESD-609 Code |
e0 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
64 |
Terminal Finish |
TIN LEAD |
Power (Watts) |
280mW |
Technology |
CMOS |
Voltage - Supply |
3.13V~3.47V |
Terminal Position |
QUAD |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
240 |
Supply Voltage |
3.3V |
Terminal Pitch |
0.5mm |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
SI3232 |
JESD-30 Code |
S-PQFP-G64 |
Function |
Subscriber Line Interface Concept (SLIC) |
Qualification Status |
Not Qualified |
Interface |
ISDN |
Number of Circuits |
2 |
Current - Supply |
28mA |
Length |
10mm |
Width |
10mm |
RoHS Status |
Non-RoHS Compliant |
SI3232-BQ Overview
A 64-TQFP package saves space on a board.For telecommunications equipment packing, the Tray method is used.The mounting type of this telecom circuit is Surface Mount.2 circuits make up this telecom IC .3.13V~3.47V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.The operating temperature set at 0°C~70°C can offer reliable performance.As part of its configuration, it includes 64 terminations.It requires a supply voltage of 3.3V.SI3232 is the base part number, which can be used to find more related parts.28mA is the supply current.
SI3232-BQ Features
Available in the 64-TQFP package
SI3232-BQ Applications
There are a lot of Silicon Labs SI3232-BQ Telecom applications.
- E1 LAN/WAN Routers
- NIU
- PBXs channel bank
- Digital access cross connects
- Wireless local loop (WLL)
- Fiber Optic Terminals
- T1/E1/J1 Multiplexer and Channel Banks
- Multichannel DS1 Test Equipment
- Digital cross connects (DSX-1)
- DECT (Digital European Cordless Telephone) Base