Parameters | |
---|---|
Package / Case | PowerPAK® ChipFET™ Single |
Number of Pins | 8 |
Operating Temperature | -50°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2017 |
Series | TrenchFET® |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Terminal Finish | Pure Matte Tin (Sn) |
Technology | MOSFET (Metal Oxide) |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Number of Channels | 1 |
Power Dissipation-Max | 3.1W Ta 31W Tc |
Element Configuration | Single |
Power Dissipation | 3.1W |
Turn On Delay Time | 12 ns |
FET Type | P-Channel |
Rds On (Max) @ Id, Vgs | 9.6m Ω @ 10A, 4.5V |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 4300pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 25A Tc |
Gate Charge (Qg) (Max) @ Vgs | 120nC @ 8V |
Rise Time | 45ns |
Drain to Source Voltage (Vdss) | 20V |
Drive Voltage (Max Rds On,Min Rds On) | 1.8V 4.5V |
Vgs (Max) | ±8V |
Fall Time (Typ) | 25 ns |
Turn-Off Delay Time | 80 ns |
Continuous Drain Current (ID) | 25A |
Gate to Source Voltage (Vgs) | 8V |
Drain to Source Breakdown Voltage | -20V |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Mount | Surface Mount |
Mounting Type | Surface Mount |