Parameters | |
---|---|
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | PowerPAK® ChipFET™ Dual |
Number of Pins | 8 |
Packaging | Cut Tape (CT) |
Published | 2013 |
Series | TrenchFET® |
Part Status | Discontinued |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Max Operating Temperature | 150°C |
Min Operating Temperature | -55°C |
Max Power Dissipation | 31W |
Technology | MOSFET (Metal Oxide) |
Number of Elements | 1 |
Element Configuration | Single |
Power Dissipation | 31W |
Turn On Delay Time | 35 ns |
FET Type | P-Channel |
Rds On (Max) @ Id, Vgs | 15m Ω @ 7A, 10V |
Vgs(th) (Max) @ Id | 2.2V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 2320pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 12A Tc |
Gate Charge (Qg) (Max) @ Vgs | 63nC @ 10V |
Rise Time | 50ns |
Drain to Source Voltage (Vdss) | 30V |
Fall Time (Typ) | 20 ns |
Turn-Off Delay Time | 60 ns |
Continuous Drain Current (ID) | 12A |
Threshold Voltage | -1V |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | -30V |
Height | 850μm |
Length | 3.08mm |
Width | 1.98mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |