Parameters | |
---|---|
Turn-Off Delay Time | 15 ns |
Continuous Drain Current (ID) | 15.9A |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 40V |
Max Junction Temperature (Tj) | 150°C |
Height | 850μm |
RoHS Status | ROHS3 Compliant |
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |
Package / Case | PowerPAK® ChipFET™ Single |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Series | TrenchFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Terminal Finish | Tin (Sn) |
Technology | MOSFET (Metal Oxide) |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Number of Channels | 1 |
Power Dissipation-Max | 31W Tc |
Power Dissipation | 3.1W |
Turn On Delay Time | 10 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 7.75m Ω @ 15A, 10V |
Vgs(th) (Max) @ Id | 2.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 1765pF @ 20V |
Current - Continuous Drain (Id) @ 25°C | 25A Tc |
Gate Charge (Qg) (Max) @ Vgs | 20nC @ 4.5V |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | +20V, -16V |