Parameters | |
---|---|
Number of Terminations | 5 |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) |
Subcategory | FET General Purpose Powers |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | C BEND |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Pin Count | 8 |
JESD-30 Code | S-XDSO-C5 |
Number of Elements | 1 |
Number of Channels | 1 |
Power Dissipation-Max | 3.8W Ta 52W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 3.8W |
Case Connection | DRAIN |
Turn On Delay Time | 12 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 3.7m Ω @ 26.1A, 4.5V |
Vgs(th) (Max) @ Id | 1.8V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 2800pF @ 6V |
Factory Lead Time | 1 Week |
Current - Continuous Drain (Id) @ 25°C | 35A Tc |
Mount | Surface Mount |
Gate Charge (Qg) (Max) @ Vgs | 70nC @ 10V |
Rise Time | 11ns |
Mounting Type | Surface Mount |
Drive Voltage (Max Rds On,Min Rds On) | 2.5V 4.5V |
Package / Case | PowerPAK® 1212-8 |
Vgs (Max) | ±12V |
Fall Time (Typ) | 10 ns |
Number of Pins | 8 |
Turn-Off Delay Time | 36 ns |
Continuous Drain Current (ID) | 26.1A |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Gate to Source Voltage (Vgs) | 12V |
Packaging | Tape & Reel (TR) |
Drain Current-Max (Abs) (ID) | 35A |
Published | 2015 |
Drain-source On Resistance-Max | 0.0037Ohm |
Drain to Source Breakdown Voltage | 12V |
Series | TrenchFET® |
Pulsed Drain Current-Max (IDM) | 60A |
JESD-609 Code | e3 |
Height | 1.04mm |
Length | 3.05mm |
Pbfree Code | yes |
Width | 3.05mm |
Part Status | Active |
Radiation Hardening | No |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
RoHS Status | ROHS3 Compliant |