Parameters | |
---|---|
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 4 |
ECCN Code | EAR99 |
Resistance | 37MOhm |
Terminal Finish | Matte Tin (Sn) |
Max Operating Temperature | 150°C |
Min Operating Temperature | -55°C |
Subcategory | FET General Purpose Power |
Max Power Dissipation | 1.47W |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Pin Count | 4 |
Number of Elements | 1 |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 1.47W |
Turn On Delay Time | 30 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 37m Ω @ 1A, 4.5V |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Current - Continuous Drain (Id) @ 25°C | 5.3A Ta |
Gate Charge (Qg) (Max) @ Vgs | 26nC @ 4.5V |
Rise Time | 145ns |
Fall Time (Typ) | 145 ns |
Turn-Off Delay Time | 45 ns |
Continuous Drain Current (ID) | 7.3A |
Gate to Source Voltage (Vgs) | 8V |
Drain Current-Max (Abs) (ID) | 5.3A |
Drain to Source Breakdown Voltage | 20V |
Height | 355.6μm |
Length | 1.5748mm |
Width | 1.6002mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 4-XFBGA, CSPBGA |
Number of Pins | 4 |
Packaging | Cut Tape (CT) |
Published | 2016 |
Series | TrenchFET® |