Parameters | |
---|---|
Pin Count | 4 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Number of Channels | 1 |
Power Dissipation-Max | 2.77W Ta 6.25W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2.77W |
Turn On Delay Time | 12 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 35m Ω @ 1A, 4.5V |
Vgs(th) (Max) @ Id | 800mV @ 250μA |
Factory Lead Time | 1 Week |
Input Capacitance (Ciss) (Max) @ Vds | 1640pF @ 4V |
Current - Continuous Drain (Id) @ 25°C | 11.7A Tc |
Contact Plating | Copper, Silver, Tin |
Gate Charge (Qg) (Max) @ Vgs | 26nC @ 5V |
Mount | Surface Mount |
Rise Time | 25ns |
Drain to Source Voltage (Vdss) | 8V |
Mounting Type | Surface Mount |
Drive Voltage (Max Rds On,Min Rds On) | 1.2V 4.5V |
Vgs (Max) | ±5V |
Fall Time (Typ) | 155 ns |
Package / Case | 4-XFBGA, CSPBGA |
Turn-Off Delay Time | 260 ns |
Continuous Drain Current (ID) | -10.2A |
Number of Pins | 4 |
Threshold Voltage | -600mV |
Gate to Source Voltage (Vgs) | 5V |
Drain Current-Max (Abs) (ID) | 7.8A |
Drain to Source Breakdown Voltage | -8V |
Transistor Element Material | SILICON |
Pulsed Drain Current-Max (IDM) | 25A |
Height | 360μm |
Length | 1.6mm |
Operating Temperature | -55°C~150°C TJ |
Width | 1.6mm |
Radiation Hardening | No |
Packaging | Tape & Reel (TR) |
REACH SVHC | Unknown |
Published | 2011 |
RoHS Status | ROHS3 Compliant |
Series | TrenchFET® |
Lead Free | Lead Free |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 4 |
ECCN Code | EAR99 |
Resistance | 35mOhm |
Terminal Finish | Matte Tin (Sn) |
Subcategory | Other Transistors |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |