Parameters | |
---|---|
Element Configuration | Single |
Operating Temperature | -55°C~150°C TJ |
Operating Mode | ENHANCEMENT MODE |
Packaging | Tape & Reel (TR) |
Power Dissipation | 780mW |
Published | 2013 |
Turn On Delay Time | 15 ns |
FET Type | P-Channel |
Series | TrenchFET® |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 100m Ω @ 1.5A, 4.5V |
JESD-609 Code | e3 |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Pbfree Code | yes |
Input Capacitance (Ciss) (Max) @ Vds | 610pF @ 10V |
Gate Charge (Qg) (Max) @ Vgs | 24nC @ 8V |
Part Status | Obsolete |
Rise Time | 25ns |
Drain to Source Voltage (Vdss) | 20V |
Drive Voltage (Max Rds On,Min Rds On) | 1.5V 4.5V |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Vgs (Max) | ±8V |
Fall Time (Typ) | 10 ns |
Turn-Off Delay Time | 35 ns |
Continuous Drain Current (ID) | -3.7A |
Threshold Voltage | -1V |
Number of Terminations | 4 |
Gate to Source Voltage (Vgs) | 8V |
Drain Current-Max (Abs) (ID) | 2.5A |
ECCN Code | EAR99 |
Drain to Source Breakdown Voltage | -20V |
Radiation Hardening | No |
REACH SVHC | Unknown |
Resistance | 100mOhm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Terminal Finish | Matte Tin (Sn) |
Subcategory | Other Transistors |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Factory Lead Time | 1 Week |
Peak Reflow Temperature (Cel) | 260 |
Mount | Surface Mount |
Time@Peak Reflow Temperature-Max (s) | 30 |
Pin Count | 4 |
Mounting Type | Surface Mount |
Package / Case | 4-XFBGA, CSPBGA |
Number of Elements | 1 |
Number of Channels | 1 |
Number of Pins | 4 |
Power Dissipation-Max | 780mW Ta 1.8W Tc |
Transistor Element Material | SILICON |