Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |
Package / Case | 4-UFBGA |
Surface Mount | YES |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Series | TrenchFET® Gen III |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 4 |
ECCN Code | EAR99 |
Terminal Finish | Tin (Sn) |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
JESD-30 Code | S-PBGA-B4 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Number of Channels | 1 |
Power Dissipation-Max | 2.8W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 1.1W |
Turn On Delay Time | 16 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 21m Ω @ 3A, 4.5V |
Vgs(th) (Max) @ Id | 900mV @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 2500pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 9.7A Tc |
Gate Charge (Qg) (Max) @ Vgs | 47nC @ 4.5V |
Drain to Source Voltage (Vdss) | 20V |
Drive Voltage (Max Rds On,Min Rds On) | 1.8V 4.5V |
Vgs (Max) | ±8V |
Turn-Off Delay Time | 300 ns |
Continuous Drain Current (ID) | -6.2A |
Gate to Source Voltage (Vgs) | 8V |
Drain-source On Resistance-Max | 0.025Ohm |
Drain to Source Breakdown Voltage | -20V |
Max Junction Temperature (Tj) | 150°C |
Height | 600μm |
RoHS Status | ROHS3 Compliant |