Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 4-XFBGA |
Number of Pins | 4 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Digi-Reel® |
Published | 2015 |
Series | TrenchFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 4 |
ECCN Code | EAR99 |
Resistance | 54mOhm |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Pin Count | 4 |
Number of Elements | 1 |
Number of Channels | 1 |
Power Dissipation-Max | 500mW Ta |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 500mW |
Turn On Delay Time | 5 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 54m Ω @ 1A, 4.5V |
Vgs(th) (Max) @ Id | 700mV @ 250μA |
Gate Charge (Qg) (Max) @ Vgs | 6.5nC @ 4.5V |
Rise Time | 15ns |
Drive Voltage (Max Rds On,Min Rds On) | 1.2V 4.5V |
Vgs (Max) | ±5V |
Fall Time (Typ) | 7 ns |
Turn-Off Delay Time | 22 ns |
Continuous Drain Current (ID) | 3.5A |
Gate to Source Voltage (Vgs) | 5V |
Drain to Source Breakdown Voltage | 8V |
Nominal Vgs | 350 mV |
Radiation Hardening | No |
REACH SVHC | Unknown |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |