Parameters | |
---|---|
Threshold Voltage | 400mV |
Gate to Source Voltage (Vgs) | 8V |
Height | 213μm |
Length | 840μm |
Width | 840μm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 4-XFBGA |
Number of Pins | 4 |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2013 |
Series | TrenchFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) |
Technology | MOSFET (Metal Oxide) |
Number of Channels | 1 |
Power Dissipation-Max | 500mW Ta |
Element Configuration | Single |
Power Dissipation | 900mW |
Turn On Delay Time | 10 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 43m Ω @ 1A, 4.5V |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Gate Charge (Qg) (Max) @ Vgs | 17nC @ 8V |
Rise Time | 20ns |
Drain to Source Voltage (Vdss) | 12V |
Drive Voltage (Max Rds On,Min Rds On) | 1.8V 4.5V |
Vgs (Max) | ±8V |
Fall Time (Typ) | 12 ns |
Turn-Off Delay Time | 30 ns |
Continuous Drain Current (ID) | 3.9A |