Parameters | |
---|---|
Mounting Type | Surface Mount |
Package / Case | Die |
Surface Mount | YES |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 2010 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 1 |
ECCN Code | EAR99 |
HTS Code | 8541.10.00.40 |
Terminal Position | UPPER |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XUUC-N1 |
Operating Temperature (Max) | 175°C |
Number of Elements | 1 |
Configuration | SINGLE |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 27μA @ 600V |
Voltage - Forward (Vf) (Max) @ If | 1.9V @ 150A |
Operating Temperature - Junction | -40°C~150°C |
Output Current-Max | 150A |
Application | FAST SOFT RECOVERY |
Current - Average Rectified (Io) | 150A DC |
Drain to Source Voltage (Vdss) | 600V |
Number of Phases | 1 |
Max Dual Supply Voltage | 600V |
Reverse Current-Max | 27μA |
RoHS Status | ROHS3 Compliant |