Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | PowerPAK® 1212-8 |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2015 |
Series | TrenchFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 5 |
ECCN Code | EAR99 |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | FLAT |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-PDSO-F5 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Number of Channels | 1 |
Power Dissipation-Max | 3.7W Ta 39.1W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 3.7W |
Case Connection | DRAIN |
Turn On Delay Time | 12 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 9m Ω @ 15A, 4.5V |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 5875pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 18A Tc |
Gate Charge (Qg) (Max) @ Vgs | 168nC @ 8V |
Rise Time | 4ns |
Drain to Source Voltage (Vdss) | 20V |
Drive Voltage (Max Rds On,Min Rds On) | 1.8V 4.5V |
Vgs (Max) | ±8V |
Fall Time (Typ) | 36 ns |
Turn-Off Delay Time | 120 ns |
Continuous Drain Current (ID) | -16.7A |
Threshold Voltage | -1V |
Gate to Source Voltage (Vgs) | 8V |
Drain-source On Resistance-Max | 0.009Ohm |
Drain to Source Breakdown Voltage | -20V |
Max Junction Temperature (Tj) | 150°C |
Height | 1.12mm |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |