Parameters | |
---|---|
Contact Material | Beryllium Copper |
Mount | Through Hole |
Mounting Type | Through Hole |
Contact Shape | Circular |
Insulation Material | Liquid Crystal Polymer (LCP) |
Housing Material | Plastic |
Operating Temperature | -55°C~125°C |
Packaging | Bulk |
Published | 2008 |
Series | SL |
JESD-609 Code | e4 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
Connector Type | Receptacle |
Number of Positions | 21 |
Number of Rows | 1 |
Additional Feature | LOW PROFILE |
Fastening Type | Push-Pull |
Contact Finish - Mating | Gold |
MIL Conformance | NO |
DIN Conformance | NO |
IEC Conformance | NO |
Filter Feature | NO |
Contact Type | Female Socket |
Mixed Contacts | NO |
Option | GENERAL PURPOSE |
Insulation Height | 0.095 2.41mm |
Style | Board to Board |
Number of Positions Loaded | All |
Pitch - Mating | 0.100 2.54mm |
Contact Length - Post | 0.095 2.41mm |
Mating Information | MULTIPLE MATING PARTS AVAILABLE |
Housing Color | Black |
Height | 1.27mm |
Length | 53.3mm |
Width | 2.54mm |
Contact Finish Thickness - Mating | 10.0μin 0.25μm |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |